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Technical Portfolio

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Technical Roadmap

Electronics, in all its forms, has always fascinated me. In today’s world of increasingly complex and intelligent hardware, building cutting-edge systems requires deep expertise across multiple domains. I’m on a long-term mission to understand electrical engineering as broadly and deeply as possible, not just as a job, but as a craft. I’m fully aware that mastering multiple fields over a career is challenging. But I believe that if approached in a structured, time-bound manner, each domain can build upon the previous — just like primary education lays the foundation for higher learning. Skills in one area often strengthen understanding in the next. To pursue this journey with focus and intent, I’ve created a theme-based learning and development roadmap. Each theme is a multi-year focus area, rooted in hands-on projects, real-world application, and product thinking.

2022-2026 : Energy-Efficient Electronics
This foundational theme explores how electronics can be designed to sip power instead of gulp it. It covers everything from efficient power conversion topologies (Buck, Boost, Flyback, LLC, etc.) to the microcontrollers and wireless stacks that drive ultra-low-power systems. These systems are deployed across real-world applications, from li-po IoT sensors to power-dense industrial drivers. All projects under this theme are developed with commercial product-grade quality, using 2 to 6-layer PCBs, precision measurements, and embedded control with microcontrollers and FPGAs. Every circuit is built with a bias toward efficiency, reliability, and practical deployment.

2027-2030 : High Speed Design & Edge AI
This theme focuses on building intelligent, high-performance electronics capable of handling large data streams and making decisions in real time. It covers high-speed PCB design involving interfaces like DDR, PCIe, USB 3.x, and MIPI, as well as the use of FPGAs and embedded platforms to accelerate AI workloads at the edge. The goal is to create fast, reliable, and production-ready boards that combine high data throughput with onboard intelligence. This includes systems that perform tasks like real-time image processing, signal analysis, or RF communication, all within strict constraints of power, latency, and form factor. All projects under this theme are developed using 6-14 layered PCBs, high-speed layout practices, and programmable logic, often integrating RF modules and antennas. Each system is built with a focus on speed, efficiency, and deployment in smart, connected environments.

2031-2035 : Robotics & Automation
This theme focuses on designing intelligent machines by combining mechanical structures, electronics, and control systems. It covers kinematics, dynamics, and actuation methods using motors like BLDC, stepper, and servo, along with embedded control for precise motion. The goal is to build reliable and efficient robotic platforms that integrate sensor fusion (IMU, vision, force sensors) with real-time processing to enable autonomous behavior. Mechanical design, material selection, and system integration play a crucial role alongside firmware and hardware development. Projects include robotic arms, mobile platforms, and automated systems developed with a holistic approach to both hardware and mechanics, emphasizing robustness, scalability, and real-world application.

2036-2040 : ASIC, SoC & RF Design
This theme explores the complete custom silicon design flow — from digital logic and RTL development to chip architecture, physical design, and verification. It covers the creation of custom IP blocks, processor subsystems, accelerators, and interfaces that form the foundation of ASICs and modern SoCs (System-on-Chip). Alongside digital chip design, this theme also delves into RF system engineering, including antenna design, impedance matching, signal integrity, and wireless protocols like BLE, LoRa, and GNSS. Projects include prototyping custom SoC blocks on FPGAs, exploring chip-level integration challenges, and designing advanced PCBs that merge high-speed digital and RF domains. The focus is on building future-ready silicon systems with tight power, area, and performance constraints — ideal for next-gen robotics, automation, and connected devices.

2041 Onwards : End to End Hardware System Design
This theme brings together everything I've learned across electronics, compute, sensing, and control to design complete, deployable hardware systems. It focuses on full product architecture — from circuit design and embedded control to mechanical integration, user experience, and manufacturability. The goal is to create robust, scalable products that solve real-world problems. This includes system-level thinking, component selection, design for manufacturing (DFM), certification planning, thermal/EMI considerations, and lifecycle management. Projects under this theme span from intelligent power systems and robotic platforms to compact embedded devices, all built with production-quality standards and long-term reliability in mind.

Technical Sectors

I have broadly divided my interest into the following sectors.

Electrical Energy

Renewable energy generation, measurement, transformation, transmission (Wired/Wireless) and storage technology.

Robotics & Automation

There is always a lot of room for automation in different industries.

Communication

Developing solutions utilizing wireless communication protocols.

Computational

Computation in every form, be it in traditional microcontroller, microprocessor or inside an FPGA.

Education

Here is a brief about my background:

Master of Engineering - Electrical & Computer with CO-OP

Field Experience

Electrical R&D Intern

Lumentum (Jan 2024 - April 2024)

Worked in a dynamic electrical engineering team, contributing to PCB design, testing, and troubleshooting for optical communications hardware.

Process R&D Engineer CO-OP Intern

Lumentum (May 2023 - December 2023)

Worked under the director level in the development of a wireless power consumption monitoring device and cloud analysis platform from scratch, aimed at finding opportunities in the reduction of electrical energy consumption of individual nodes (standalone equipment or full-fledged processing stations), minimizing the carbon emissions, process inefficiencies and costs involved.

University of Ottawa (2022-2024)

Bachelor of Engineering - Electronics & Telecommunication

Government College of Engineering Nagpur (2017-2021)

Hardware Lead - Radar based Elderly Vital Signs and Fall Detection

Zodiac Light Waves in assoc. with University of Ottawa (Jan 2024- April 2024)

Led the system hardware design, firmware design and interface with RNN Machine Learning model and testing under the supervision of Prof. Miodrag Boilc, working with a range of FMCW Microwave Radars.

Independent Electrical Engineer & Consultant

Electrohouse & Varsity Tutors (Jan 2025 - Current)

Developing unique electronic solutions with a focus on embedded hardware applications in the sustainable energy domain. Currently building a wireless, high-precision Quad-Channel DC Power Monitor Series for smart energy tracking. In parallel, consulting long-term for a Toronto-based startup, designing custom motion and input capture hardware for integration with modern game engines

Research Project Intern (Autonomous Drone Surveillance)

R&D Department - Solar Industries India Ltd. (March 2020 - August 2020)

Led the hardware intern team working predominantly on a multitude of sensors (LIDAR, Gyroscope, Accelerometer, Proximity, Multi-Spectrum Cameras), wireless networking, onboard controllers, battery (LiPo) and power management.

Technical Projects Portfolio

I have worked on a wide range of projects, some of which are presented here.